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High Thermal Conductivity Materials for Thermal Management Applications

United States Patent Application

View the Complete Application at the US Patent & Trademark Office
High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.
BROIDO, David A. (Needham, MA), REINECKE, Tom L. (Alexandria, VA), LiINDSAY, Lucas R. (Alexandria, VA)
14/ 763,993
January 29, 2013
STATEMENT OF GOVERNMENT SUPPORT [0002] This invention was made with Government Support under Contract Number 1066634 awarded by the United States National Science Foundation, and under contract Number DE-FG02-09ER46577 awarded by the United States Department of Energy. The Government has certain rights in the invention.