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ENERGY EFFICIENCY AWARE THERMAL MANAGEMENT IN A MULTI-PROCESSOR SYSTEM ON A CHIP

United States Patent Application

20150286257
A1
View the Complete Application at the US Patent & Trademark Office
Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip ("SoC") are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service ("QoS") by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.
PARK, HEE JUN (SAN DIEGO, CA), KANG, YOUNG HOON (SAN DIEGO, CA), ALTON, RONALD FRANK (OCEANSIDE, CA), MEDRANO, CHRISTOPHER LEE (LONGMONT, CO), ANDERSON, JON JAMES (BOULDER, CO)
QUALCOMM INCORPORATED (SAN DIEGO CA)
14/ 280,631
May 18, 2014
STATEMENT REGARDING RELATED APPLICATIONS [0001] This application claims priority under 35 U.S.C. .sctn.119 as a non-provisional application of U.S. Provisional Patent Application 61/977,013 filed on Apr. 8, 2014 and entitled SYSTEM AND METHOD FOR THERMAL MITIGATION IN A SYSTEM ON A CHIP, the entire contents of which is hereby incorporated by reference. This application also claims priority under 35 U.S.C. .sctn.119 as a non-provisional application of U.S. Provisional Patent Application 61/981,714 filed on Apr. 18, 2014 and entitled ENERGY EFFICIENCY AWARE THERMAL MANAGEMENT IN A HETEROGENEOUS MULTI-PROCESSOR SYSTEM ON A CHIP, the entire contents of which is hereby incorporated by reference. This application is related to two non-provisional applications both entitled ENERGY EFFICIENCY AWARE THERMAL MANAGEMENT IN A MULTI-PROCESSOR SYSTEM ON A CHIP filed in the United States Patent and Trademark Office on May 18, 2014 and respectively having Attorney Docket Numbers 141627U1 and 141627U2, the entire contents of both applications are hereby incorporated by reference.