A multi-chip module (MCM) is disclosed, which in some embodiments can include a packaging substrate, an interposer coupled to the substrate and having a power converter coupled to one or more vias, and a CMOS integrated circuit comprising one or more connecters aligned with and disposed proximate to the one or more vias to electrically couple the interposer to the integrated circuit. Methods of forming a voltage regulator on an interposer of a multi-chip module (MCM) are also provided.
STATEMENT REGARDING FEDERALLY-SPONSORED RESEARCH
 This invention was made with government support from the U.S. Department of Energy under Grant No. DE-EE002892 and the National Science Foundation under Grant No. EECS-0903466. The government has certain rights in the Invention.