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SYSTEMS AND METHODS FOR INTEGRATED VOLTAGE REGULATORS

United States Patent Application

20150042400
A1
View the Complete Application at the US Patent & Trademark Office
A multi-chip module (MCM) is disclosed, which in some embodiments can include a packaging substrate, an interposer coupled to the substrate and having a power converter coupled to one or more vias, and a CMOS integrated circuit comprising one or more connecters aligned with and disposed proximate to the one or more vias to electrically couple the interposer to the integrated circuit. Methods of forming a voltage regulator on an interposer of a multi-chip module (MCM) are also provided.
Sturcken, Noah Andrew (New York, NY), Shepard, Kenneth L. (New York, NY)
The Trustees of Columbia University in the City of New York (New York NY)
14/ 333,427
July 16, 2014
STATEMENT REGARDING FEDERALLY-SPONSORED RESEARCH [0002] This invention was made with government support from the U.S. Department of Energy under Grant No. DE-EE002892 and the National Science Foundation under Grant No. EECS-0903466. The government has certain rights in the Invention.