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INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD

United States Patent Application

20140101933
A1
View the Complete Application at the US Patent & Trademark Office
Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.
Chainer, Timothy J. (Putnam Valley, NY), Graybill, David P. (Staatsburg, NY), Iyengar, Madhusudan K. (Woodstock, NY), Kamath, Vinod (Raleigh, NC), Kochuparambil, Bejoy J. (Apex, NC), Schmidt, Roger R. (Poughkeepsie, NY), Steinke, Mark E. (Durham, NC)
International Business Machines Corporation (Armonk NY)
14/ 106,845
December 15, 2013
GOVERNMENT LICENSE RIGHTS [0002] This invention was made with the United States Government support under Agreement No. DE-EE0002894 awarded by the Department of Energy. The Government has certain rights in the invention.