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Method for Plating Fine Grain Copper Deposit on Metal Substrate

United States Patent Application

View the Complete Application at the US Patent & Trademark Office
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A method of depositing an oxygen-free electronic copper layer on a metal substrate is provided that includes cleaning a substrate surface, electropolishing the substrate surface activating the substrate surface, depositing nickel on the substrate; and depositing copper on the substrate using a cyanide copper strike bath and a cyanide copper plate bath, where a periodic pulse and a reverse periodic pulse current is applied using a pulse periodic reverse current power supply, where the deposited oxygen-free copper comprises a fine-grained, equiaxed structure having a uniform surface geometry and less than 10% thickness variation across all surfaces.
Farvid, Ali A. (Palo Alto, CA)
14/ 593,313
January 9, 2015
STATEMENT OF GOVERNMENT SPONSORED SUPPORT [0002] This invention was made with Government support under grant (or contract) no. DE-AC02-76SF00515 awarded by the Department of Energy. The Government has certain rights in the invention.