A method, system and apparatus, the method including positioning a microelectronic device on a carrier substrate; coupling the microelectronic device to a roller assembly; and rotating the roller assembly to transport the microelectronic device from the carrier substrate to a receiving substrate. The system including a carrier substrate configured to support a microelectronic device; a roller assembly configured to receive and transport the microelectronic device; and a receiving substrate dimensioned to receive the microelectronic device from the roller assembly. An apparatus for parallel assembly of microelectronic devices on a module including a laterally translatable carrier substrate configured to move a plurality of microelectronic devices in a first direction; a rotatable cylindrical body having a plurality of device openings dimensioned to receive the microelectronic devices; and a laterally translatable receiving substrate configured to move in a second direction.
 This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.