A non-arcing atmospheric pressure plasma processing reactor that includes a wafer platform that is electrically conductive and operatively placed near at least one radio frequency electrode to allow the creation of an electric field. An rf power supply is electrically attached to both the radio frequency electrode and the wafer platform to create said electric field for generation of said non-arcing atmospheric pressure plasma. A process gas supply comprising a mixture of 90% to 99% support gas to 1 % to 10% reactive gas is supplied to the electric field to generate the atmospheric pressure plasma.
STATEMENT REGARDING FEDERAL RIGHTS
 This invention was made with government support under Contract No. W-7405-ENG-36 awarded by the U.S. Department of Energy. The government has certain rights in the invention.