Various technologies pertaining to characterizing a component of a large surface area array electronic device, such as a focal plane array (FPA), are described. A first semiconductor chip is reversibly hybridized with a second semiconductor chip through use of a conductive layer. Responsive to being reversibly hybridized, at least one of the first semiconductor chip or the second semiconductor chip is characterized as being defective or suitable for deployment. Thereafter, the conductive layer is removed, and the first semiconductor chip is separated from the second semiconductor chip without damaging either of the first semiconductor chip or the second semiconductor chip.
STATEMENT OF GOVERNMENTAL INTEREST
 This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.