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METHOD OF FABRICATING ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS

United States Patent Application

20150216051
A1
View the Complete Application at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A method of fabricating high-density, preferably bio-compatible, electrical feedthrough structures and interfaces by extruding electrically conductive material into electrically conductive film-coated throughholes formed on an electrically non-conductive substrate to form extrusion-formed electrically conductive vias which pass through the substrate for microelectronic applications.
Shah, Kedar G. (San Francisco, CA), Pannu, Satinderpall S. (Pleasanton, CA)
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (LIVERMORE CA)
14/ 367,759
December 21, 2012
FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] The United States Government has rights in this invention pursuant to Contract No. DE-AC52-07NA27344 between the United States Department of Energy and Lawrence Livermore National Security, LLC for the operation of Lawrence Livermore National Laboratory.