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United States Patent Application

View the Complete Application at the US Patent & Trademark Office
A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion.
Johnson, Matthew (Overland Park, KS)
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City MO)
14/ 086,835
November 21, 2013
GOVERNMENT INTERESTS [0001] The present invention was developed with support from the U.S. government under a contract with the United States Department of Energy, Contract No. DE-NA0000622. Accordingly, the U.S. government has certain rights in the present invention.