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SILVER THICK FILM PASTE HERMETICALLY SEALED BY SURFACE THIN FILM MULTILAYER

United States Patent Application

*** PATENT GRANTED ***
20150090478
9,648,740
A1
View the Complete Application at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold.
Wolf, Joseph Ambrose (Kansas City, MO), Peterson, Kenneth A. (Albuquerque, NM)
14/ 502,745
September 30, 2014
GOVERNMENT LICENSE RIGHTS UNDER FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT [0002] This invention was developed with government support under Contract DE-NA0000622 with Honeywell Federal Manufacturing & Technologies, LLC and the U.S. Department of Energy, and under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.