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FLEXIBLE PACKAGING FOR MICROELECTRONIC DEVICES

United States Patent Application

20150114451
A1
View the Complete Application at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
Microsystems Enabled Photovoltaics (MEPV)
An apparatus, method, and system, the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate; an encapsulation layer encapsulating the microelectronic device and the substrate; a protective layer positioned around the encapsulating layer; and a reinforcing layer coupled to the protective layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device. The method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer; sealing the encapsulated microelectronic device within a protective layer; and coupling the protective layer to a reinforcing layer, wherein the substrate, encapsulation layer, protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device.
Anderson, Benjamin John (Albuquerque, NM), Nielson, Gregory N. (Albuquerque, NM), Cruz-Campa, Jose Luis (Albuquerque, NM), Okandan, Murat (Edgewood, NM), Lentine, Anthony L. (Albuquerque, NM), Resnick, Paul J. (Albuquerque, NM)
Sandia Corporation (Albuquerque NM)
14/ 068,189
October 31, 2013
GOVERNMENT RIGHTS [0001] This invention was developed under Contract DE-AC04-94AL85000 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.