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United States Patent Application

View the Complete Application at the US Patent & Trademark Office
A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.
Schmitz, Roger William (Hutchinson, MN), Oh, Yunje (Medina, MN)
14/ 358,065
November 14, 2012
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] This invention was made with Government support under (DE-FG02-07ER84812) awarded by the Department of Energy. The Government has certain rights in this invention.