Skip to Content
Find More Like This
Return to Search

METHOD OF MAKING DIELECTRIC CAPACITORS WITH INCREASED DIELECTRIC BREAKDOWN STRENGTH

United States Patent Application

20130335882
A1
View the Complete Application at the US Patent & Trademark Office
The invention is directed to a process for making a dielectric ceramic film capacitor and the ceramic dielectric laminated capacitor formed therefrom, the dielectric ceramic film capacitors having increased dielectric breakdown strength. The invention increases breakdown strength by embedding a conductive oxide layer between electrode layers within the dielectric layer of the capacitors. The conductive oxide layer redistributes and dissipates charge, thus mitigating charge concentration and micro fractures formed within the dielectric by electric fields.
Ma, Beihai (Naperville, IL), Balachandran, Uthamalingam (Willowbrook, IL), Liu, Shanshan (Naperville, IL)
UCHICAGO ARGONNE, LLC. (Chicago IL)
13/ 523,335
June 14, 2012
CONTRACTUAL ORIGIN OF THE INVENTION [0001] The U.S. Government has rights in this invention pursuant to Contract No. DE-AC02-06CH11357 between the U.S. Department of Energy and UChicago Argonne, LLC.