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Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components

United States Patent Application

20050208706
A1
View the Complete Application at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A method of creating a multi-layered monolithic circuit structure wherein individual layers of standard alumina thick film ceramic substrate and the resistors, inductors, capacitors, and other circuit componentry printed thereon are fired, and the circuit componentry trimmed or otherwise adjusted to achieve a desired degree of precision prior to combining the layers with a thick film glass bonding agent to form the monolithic structure.
Blazek, Roy J. (Overland Park, KS), Barner, Gregory Eugene (Overland Park, KS), Bandler, Sam William (Olathe, KS), Eubank, Eric (Lee's Summit, MO), Uribe, Fernando (Albuquerque, NM), Smith, Patrick A. (Albuquerque, NM)
10/ 802,203
March 17, 2004
[0001] The present invention was developed with support from the U.S. government under Contract No. DE-AC04-01AL66850 with the U.S. Department of Energy. Accordingly, the U.S. government has certain rights in the present invention.