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Decal transfer microfabrication

United States Patent Application

20050199584
A1
View the Complete Application at the US Patent & Trademark Office
A method of making a microstructure includes forming a pattern in a surface of a silicon-containing elastomer, oxidizing the pattern, contacting the pattern with a substrate; and bonding the oxidized pattern and the substrate such that the pattern and the substrate are irreversibly attached. The silicon-containing elastomer may be removably attached to a transfer pad.
Nuzzo, Ralph G. (Champaign, IL), Childs, William Robert (Champaign, IL)
The Board of Trustees of the University of Illinois
10/ 911,049
August 4, 2004
[0001] The subject matter of this application was in part funded by the National Science Foundation (Grant no. CHE 0097096); by the Defense Advanced Research Projects Agency (DARPA; Grant no. SPAWAR: N66001-98-1-8915); and by the Department of Energy (DOE Grant no. DEFG02-91ER45439). The government may have certain rights in this invention.