An apparatus, comprising a heat sink located on a surface of an electronic device, the heat sink including a plurality of metal layers wherein: at least one exterior edge of the metal layers faces the surface, the metal layers form a stack running along the surface, and the metal layers have a plurality of openings in a major surface of the metal layers, the openings configured to carry a fluid there-through.
STATEMENT OF GOVERNMENT INTEREST IN THE INVENTION
 The present application was made with government support under Department of Energy Grant No. Government (DE-EE0002895). The United States government may have certain rights in the invention.