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HEAT SINK WITH A STACK OF METAL LAYERS HAVING CHANNELS THEREIN

United States Patent Application

20130058043
A1
View the Complete Application at the US Patent & Trademark Office
An apparatus, comprising a heat sink located on a surface of an electronic device, the heat sink including a plurality of metal layers wherein: at least one exterior edge of the metal layers faces the surface, the metal layers form a stack running along the surface, and the metal layers have a plurality of openings in a major surface of the metal layers, the openings configured to carry a fluid there-through.
Czapla, Steve (Landing, NJ), Mann, JR., Robert (Mt. Arlington, NJ), Ramsey, David A. (City of Maplewood, NJ), Salamon, Todd R. (City of New Providence, NJ)
Weiss-Aug Co. Inc (East Hanover NJ), Alcatel-Lucent, USA Inc. (Murray Hill NJ)
13/ 454,967
April 24, 2012
STATEMENT OF GOVERNMENT INTEREST IN THE INVENTION [0002] The present application was made with government support under Department of Energy Grant No. Government (DE-EE0002895). The United States government may have certain rights in the invention.