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METHOD FOR FABRICATION OF CERAMIC DIELECTRIC FILMS ON COPPER FOILS

United States Patent Application

20100302706
A1
View the Complete Application at the US Patent & Trademark Office
Argonne National Laboratory - Visit the Technology Development and Commercialization Website
Fabricating Dielectric Ceramic Films on Copper Foils (IN-09-006)
The present invention provides a method for fabricating a ceramic film on a copper foil. The method comprises applying a layer of a sol-gel composition onto a copper foil. The sol-gel composition comprises a precursor of a ceramic material suspended in 2-methoxyethanol. The layer of sol-gel is then dried at a temperature up to about 250.degree. C. The dried layer is then pyrolyzed at a temperature in the range of about 300 to about 450.degree. C. to form a ceramic film from the ceramic precursor. The ceramic film is then crystallized at a temperature in the range of about 600 to about 750.degree. C. The drying, pyrolyzing and crystallizing are performed under a flowing stream of an inert gas. In some embodiments an additional layer of the sol-gel composition is applied onto the ceramic film and the drying, pyrolyzing and crystallizing steps are repeated for the additional layer to build up a thicker ceramic layer on the copper foil. The process can be repeated one or more times if desired.
MA, Beihai (Naperville, IL), NARAYANAN, Manoj (Woodridge, IL), DORRIS, Stephen E. (LaGrange Park, IL), BALACHANDRAN, Uthamalingam (Willowbrook, IL)
UCHICAGO ARGONNE, LLC (Chicago IL)
12/ 786,940
May 25, 2010
CONTRACTUAL ORIGIN OF THE INVENTION [0002] The United States Government has rights in this invention pursuant to Contract No. W-31-109-ENG-38 between the United States Government and The University of Chicago and/or pursuant to Contract No. DE-AC02-06CH11357 between the United States Government and UChicago Argonne, LLC representing Argonne National Laboratory.