An apparatus includes a set of first metal contact pads disposed on a low temperature co-fired ceramic substrate. A plurality of metalized interconnectors extend between a digital electronic component and the low temperature co-fired ceramic substrate. The apparatus is configured to operate at a temperature greater than 250 degrees Celsius.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH & DEVELOPMENT
 This invention was made with Government support under contract number DE-EE0002755 awarded by U.S. Dept. of Energy. The Government has certain rights in the invention.