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ELECTRONIC CIRCUIT BOARD AND A RELATED METHOD THEREOF

United States Patent Application

20120155044
A1
View the Complete Application at the US Patent & Trademark Office
An apparatus includes a set of first metal contact pads disposed on a low temperature co-fired ceramic substrate. A plurality of metalized interconnectors extend between a digital electronic component and the low temperature co-fired ceramic substrate. The apparatus is configured to operate at a temperature greater than 250 degrees Celsius.
Shaddock, David Mulford (Troy, NY), Tilak, Vinayak (Niskayuna, NY), Zhang, Tan (Niskayuna, NY)
GENERAL ELECTRIC COMPANY (SCHENECTADY NY)
12/ 971,862
December 17, 2010
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH & DEVELOPMENT [0001] This invention was made with Government support under contract number DE-EE0002755 awarded by U.S. Dept. of Energy. The Government has certain rights in the invention.