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Release Strategies for Making Transferable Semiconductor Structures, Devices and Device Components

United States Patent Application

View the Complete Application at the US Patent & Trademark Office
Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
ROGERS, John A. (Champaign, IL), NUZZO, Ralph G. (Champaign, IL), MEITL, Matthew (Raleigh, NC), KO, Heung Cho (Urbana, IL), YOON, Jongseung (Urbana, IL), MENARD, Etienne (Durham, NC), BACA, Alfred J. (Urbana, IL)
The Board of Trustees of the University of Illinois (Urbana IL)
13/ 228,041
September 8, 2011
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] This invention was made with government support under Grant DEFG02-91-ER45439 awarded by Department of Energy. The government has certain rights in the invention.