A thin film measurement technique is disclosed. The thin film measurement technique comprises radioisotopes, radiation detectors, mechanical hardware, electronics and/or circuitry, wires, cables, connectors, measurement software, and a computer. One aspect of the thin film measurement technique pertains to measurement sensors, which measure radiation emerging from material surfaces. Another aspect of the disclosure pertains to mechanical hardware that enables the thin film measurement to be made. Another aspect of the disclosure pertains to filter housings. Another aspect of the disclosure pertains to measurement software, for quantifying the measurement from the sensor, and/or controlling and optimizing processes based on said measurements. Another aspect of the disclosure pertains to hardware and equipment utilizing the thin film measurement technique. All aspects can be utilized alone or in combination with one another.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
 This invention was made with Government support under Grant No. DE-FG02-07ER86310 awarded by the Department of Energy. The Government has certain rights in this invention.