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Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder

United States Patent Application

View the Complete Application at the US Patent & Trademark Office
A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag.sub.3Sn blades.
Anderson, Iver E. (Ames, IA), Harringa, Joel L. (Ames, IA), Boesenberg, Adam J. (Ames, IA)
Iowa State University Research Foundation, Inc.
13/ 066,748
April 22, 2011
CONTRACTUAL ORIGIN OF THE INVENTION [0002] This invention was made with government support under Contract No. DE-ACO2-07CH11358 awarded by the U.S. Department of Energy. The government has certain rights in the invention.