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Disposable, High Pressure Microfluidic Chips

United States Patent Application

View the Complete Application at the US Patent & Trademark Office
Lawrence Berkeley National Laboratory - Visit the Technology Transfer and Intellectual Property Management Department Website
An injection molding process for the fabrication of disposable unitary plastic microfluidic chips with a cycle time on the order of minutes is described. The microfluidic chips feature novel, integrated, reversible, standardized, ready-to-use inter-connects that enable operation at pressures not before realized with microfluidic chips.
Mair, Dieudonne (Santa Clara, CA), Geiger, Emil J. (Oakland, CA)
The Regents of the University of California (Oakland CA)
12/ 304,902
June 19, 2007
STATEMENT OF GOVERNMENTAL SUPPORT [0002] The invention described and claimed herein was made in part utilizing funds supplied by the U.S. Department of Energy under Contract No. DE-ACO3-76SF00098, and more recently under DE-ACO2-05CH11231. The government has certain rights in this invention.