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PRINTED CIRCUIT BOARD

United States Patent Application

20110168435
A1
View the Complete Application at the US Patent & Trademark Office
A printed circuit board includes, but is not limited to, a plurality of electrically conductive layers and a plurality of dielectric layers. Each dielectric layer is interposed between adjacent conductive layers to form a body of alternate conductive layers and dielectric layers. At least one of the electrically conductive layers protrudes beyond an end of the body.
BARRY, ALAN L. (TORRANCE, CA), SMITH, ELI B. (BELLFLOWER, CA), MANN, BROOKS S. (REDONDO BEACH, CA), HERRON, NICHOLAS HAYDEN (REDONDO BEACH, CA), KORICH, MARK D. (CHINO HILLS, CA), TANG, DAVID (FONTANA, CA), CHOU, CINDY (LAKEWOOD, CA)
GM GLOBAL TECHNOLOGY OPERATIONS, INC. (DETROIT MI)
12/ 686,775
January 13, 2010
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0001] This invention was made with Government support under DE-FC26-07NT43123, awarded by the Department of Energy. The Government has certain rights in this invention.