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THREE-DIMENSIONAL PATTERNING METHODS AND RELATED DEVICES

United States Patent Application

*** PATENT GRANTED ***
20110126892
9,530,912
A1
View the Complete Application at the US Patent & Trademark Office
Three-dimensional patterning methods of a three-dimensional microstructure, such as a semiconductor wire array, are described, in conjunction with etching and/or deposition steps to pattern the three-dimensional microstructure.
PUTNAM, Morgan C. (Pasadena, CA), Kelzenberg, Michael D. (Pasadena, CA), Atwater, Harry A. (South Pasadena, CA), Boettcher, Shannon W. (Eugene, OR), Lewis, Nathan S. (La Canada, CA), Spurgeon, Joshua M. (Pasadena, CA), Turner-Evans, Daniel B. (Pasadena, CA), Warren, Emily L. (Pasadena, CA)
12/ 956,422
November 30, 2010
STATEMENT OF GOVERNMENT GRANT [0002] The present application was supported in part by the Department of Energy under grant DE-SC0001293 and grant DE-FG02-07ER46405. The US government may have certain rights in the invention.