Disclosed is a whisker-formation resistant composition that is suitable for use as a lead-free soldering composition. The composition includes a fusible material and a matrix material that is aggregated with the fusible material. Typically the fusible material has a lower melting temperature than the melting temperature of the matrix material and has a coefficient of thermal expansion that is higher than the coefficient of thermal expansion of the matrix material. Also provided is a method of reducing the formation of whiskers adjacent solder that bridges a joint. The method includes the step of melting a fusible material adjacent the joint. A further step is solidifying the fusible material while establishing a static tensile stress tendency in the fusible material.
 The U.S. Government has rights to this invention pursuant to contract number DE-AC05-00OR22800 between the U.S. Department of Energy and Babcock & Wilcox Technical Services Y-12, LLC.