A novel means for placing conductive metal traces on ceramic without adhesives, glues or any organic materials. Metal traces created by thermal spraying metal on to a prepared ceramic surface. The ceramic surface is prepared by creating recesses where the metal is to remain as circuit traces. Following thermal spray, the excess metal is removed from the surface leaving the metal electrically conductive traces in the ceramic recesses. This process improves metal to ceramic bond, reducing failures caused from thermal expansion differences between ceramic and metal traces and eliminates all organic adhesives.
 Part of this invention was developed under Contract DE-AC04-94AL8500 between Sandia Corporation and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.
 The remaining parts of this invention were developed under award number DE-FG36-08GO18185 between Perma Works LLC and the U.S. Department of Energy. The U.S. Government has certain rights in this invention.