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ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES

United States Patent Application

20110017608
A1
View the Complete Application at the US Patent & Trademark Office
A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.
Taylor, E. Jennings (Troy, OH), Sun, Jenny J. (St. Joseph, MI), Lozano-Morales, Alonso (Huber Heights, OH), McCrabb, Heather (Kettering, OH), Inman, Maria E. (Yellow Springs, OH)
FARADAY TECHNOLOGY, INC. (Clayton OH)
12/ 843,968
July 27, 2010
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] This invention was made with U.S. Government support under U.S. Department of Energy DE-FG02-08ER85112. The U.S. Government has certain rights in the invention.