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Method and apparatus for laser ablative modification of dielectric surfaces

United States Patent Application

20040195221
A1
View the Complete Application at the US Patent & Trademark Office
The present invention provides a method and apparatus (100) for laser (101) ablative modification of surfaces (120). The apparatus (100) includes a controller adapted to determine the wavelength corresponding to a characteristic wavelength of the absorption band, as well as an intensity and a duration such that a light pulse with the determined wavelength, intensity, and duration is capable of heating the portion of the dielectric material (120) to approximately the critical temperature of the dielectric material on a time scale less than about the characteristic time scale for thermal diffusion in the dielectric material and thereby inducing a phase explosion in the dielectric material. The apparatus further includes a laser (101) capable of providing at least one light pulse with the determined wavelength, intensity and duration in response to a signal from the controller.
Haglund Jr, Richard F. (Nashville, TN), Ermer, David (Mississippi, MS)
10/ 476,687
May 17, 2004
[0002] This work was supported in part by the Office of Naval Research under the Medical Free-Electron Laser Program (Contract N00014-94-1-1023); the Office of Science, U.S. Department of Energy (Contract DE-FG07-98ER62710); Vanderbilt's Molecular Biophysics Training Grant funded by the National Institutes of Health, Number 2T32GM08320-19; and the Research Experience for Undergraduates Program of the National Science Foundation, Grant Number 99-104352.