A multiple zone hermetic inverter/converter chamber for cooling power electronics using direct contact cooling in the liquid refrigerant zone and vapor refrigerant zone located in the hermetic container, and indirect non-contact cooling in the ambient cooling zone located in the interstitial space between the hermetic container and the thermally isolated housing. The ambient cooling zone operates at atmospheric pressure.
 This invention was made with Government support under contract no. DE-AC05-00OR22725 to UT-Battelle, LLC, awarded by the United States Department of Energy. The Government has certain rights in the invention.